Surface Mount Technology for Concurrent Engineering and Manufacturing (Electronic Packaging and Interconnection Series)

Surface Mount Technology for Concurrent Engineering and Manufacturing (Electronic Packaging and Interconnection Series) by Classon, Frank. hardcover edition. ISBN: 9780070112001.

A guide to gaining the valuable miniaturization and cost-saving benefits of surface mount technology (SMT), showing how to integrate multiple company functions - designs, manufacturing, testing and management - and save time and money at every stage. The book contains chapters on: implementing SMT into the total company; fundamentals of SMT in design and manufacturing; SMT components in design and in assembly operations; SMT substrate configuration and manufactirong; SMT solders and application methods; assembly types and production methods; high quality for competitive effectiveness; acceptance testing and troubleshooting; rework and repair; production operations; and future SMT design and production in the near-term. It should be of interest to all who have SMT decision-making and/or implementation responsibilities, including design engineers, managers from all operating divisions, and manufacturing engineers, as well as quality assurance, procurement, material and test personnel.